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It supports eight DDR4 memory channels and has a thermal design power (TDP) of up to 180W.
While these specifications were competitive when first introduced, things have moved on significantly since.
It could also signal Huaweis efforts to maintain competitiveness in the HPC and server markets dominated byIntelXeon andAMDEPYC.
Kernel patches, however, have previously indicated work on integrating HBM into the platform.
The patch series includes detailed descriptions of this functionality.
Huawei explains that HBM offers higher bandwidth but consumes more power.
The patches also introduce a driver for HBM cache, enabling user-space control over this feature.
When workloads are less demanding, the cache can be powered down to save energy.