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The architecture focuses on improving how XPUs - used in advanced AI and cloud computing systems - handle memory.
This could potentially allow XPUs to support up to 33% more HBM stacks, massively boosting memory density.
The leading cloud data center operators have scaled with custom infrastructure.
HBM plays a central role in XPUs, which use advanced packaging technology to integrate memory and processing power.
Traditional architectures, however, limit scalability and energy efficiency.
The collaboration with leading memory makers reflects a broader trend in the industry toward highly customized hardware.
